FlexTRAK™-CD platform is designed for high throughput processing of lead frame strips, laminated substrates, and other strip-type electronic components, up to 5 strips per plasma cycle.
Superior Plasma Processing, Small Footprint, High-Throughput
The patented plasma chamber design provides high uniformity and process repeatability. It ensures all areas of the substrate are treated uniformly, while tight control over process parameters provides highly repeatable results.
The system accommodates a wide range of strip sizes, yielding unmatched production flexibility. Its small chamber volume and proprietary process control system provide short cycle times, with high machine autonomy.
Plasma for pre-die attach, pre-wire bond, pre-mold encapsulation and pre-underfill such as:
Kir ve Artık Uzaklaştırma & Yüzey Temizleme
Florin & diğer halojenler
Metal & metal oksitleri