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Esman invites you and your colleagues to 9th Esman Seminar

The Lead-Free Soldering will be the main theme of our seminar, just like last seminar, which will be mandatory to use as of 1st July 2006. Our valued partners Assembléon, Cookson Electronics, Dek, Btu, Vitronics Soltec, Tecan, JBC and industry expert Mr.Bob Willis will contribute to this great organisation. The success stories, procedures and application methods will be covered during the Lead-Free seminar.

The transition from leaded to lead-free soldering process is not easy. Alloys, flux, PCB's and components and their affect on process have to be understood very well. The other critical point is the narrowing process window.  The seminar programme focuses on experience, evaluations, safety, process and equipments.
 
Traditional 9th Esman Seminar will take place in Istanbul Crown Plaza Hotel on 15th September 2005. Please see below for the agenda.
 
We will be more than happy to have you at our Seminar.
 
Best Regards,
 
Esman Electronics Group
 
Please register latest on 8th of September 2005.
 
Contact : Perinaz Anakan
Tel: 0212 217 66 20
Fax: 0212 217 67 97
e-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.
 
 
 

 

9. ESMAN Elecronics Group Seminar
Crowne Plaza Hotel, İstanbul
 15 September2005       
                                                                                     
 
Companies
Speakers
Topics
09:00
Esman
Mehmet Şen
Welcome
09:15
Electronic Presentation Services (EPS)
Bob Willis
Legislation and trends for Lead Free Soldering
09:30
Cookson Electronics (Alpha Metals)
Gerard P. Campbell
Alloy selection in lead-free
 
 
 
Solder alloy cost of manufacture
 
 
 
Lead free paste, selection criteria
 
 
 
Flux selection in lead-free
 
 
 
VOC-free materials
11:00
Coffee Break
 
 
11:15
Vitronics Soltec
Gerjan Diepstraten
Lead-free and its effects on wave soldering process parameters
 
 
 
PCB finishes with lead-free
 
 
 
Wave soldering process control
12:15
Lunch Break
 
 
13:15
EPS
Bob Willis
Lead-free components
 
 
 
Components storage
13:30
Dek Printing Machines
John Brazell
The effects of the lead-free on printing technologies
 
 
 
Inspection results on lead-free paste
14:00
Tecan Stencils
Tony Weldon
The effects of lead-free on stencil design and manufacturing methods
 
 
 
Design for 01005 and through hole reflow
14:30
Coffee Break
 
 
14:45
Assembléon
Marina Nikeschina
The effects of the lead-free on surface mount placement parameters and criteria
15:30
BTU
Gerald Rutter
Peter Franklin
The effects of the lead-free on reflow curing process parameters (profiles, critical issues)
 
 
 
The N2 usage with lead-free   
 
 
 
Cooling and impact on solderability
16:15
Coffee Break
 
 
16:30
JBC Soldering Tools
Luca Chiochia
The effects of the lead-free on rework and touch-up    ( live show )
17:00
EPS
Bob Willis
PCB design
 
 
 
Lead-free PCB finish
 
 
 
Lead-free inspection
 
 
 
Lead-free Process Defects
17:30
Questions & Answers Session
All Speakers
 
*Crowne Plaza Hotel; Sahilyolu 34710 Ataköy, İstanbul

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